Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module Electronics

In recent years, considerable attention has been paid to gallium-based liquid metal alloys in their use as thermal interface materials for GPU, APU, and HPC PC super computers due its considerably high conductivity low contact resistance. Gallium-based Liquid paste containing content of particles (LMP-MPs) enhance performance controllable BLT the prepared composites (TIMs) by in-situ introducing gallium oxide into will be reported our research. this paper, we report effect composition, particle size/types, bond line thickness on properties LMP-MPs. Thermal LMP-MPs were measured at 50o C using a tester, TIMA5, based ASTM-D5470 test methodology. It was found present study that composition types particles, have significant influence conductivity, values increase with an BLT. However, resistance varies change Scanning electron microscope (SEM) used characterize microstructure different sizes. Micrographic morphology LMPs-MPs shows continuous frame structure observed SEM, which could keep metals from spreading out stabilize phase. We eventually better wetting adhesion bare Cu, glass Si surface than endows good printability Continuous monitoring 45o 89o house-made tester stable after few months, indicates excellent reliability ambient atmosphere.